Shipped Tens of Millions Of Devices to customers including Samsung.
SANA Semiconductors is a fabless company specializing in developing Power Amplifier Modules (PAMs) for mobile phones and other 3G/4G/5G wireless devices.
Apart from offering the traditional pin compatible solutions, SANA leads the industry by delivering single band PAMs in the form factor of 2 mm x 2 mm and dual and quad band PAMs in 2.5 mm x 3 mm, which are the world’s smallest in the respective classes.
By employing advanced monolithic designs and simplified packaging methodologies, SANA has leading edge technical strengths and experiences in producing single, dual, triple and quad band PAMs in reduced sizes and with top performance for 3G/4G/5G applications.
SM54068-1 Power Amplifier Module (PAM) is a fully matched 42 pin surface mount module developed for multimode multiband (MMMB) applications. This MMMB PAM covers the low, mid and high bands, and meets the stringent spectral linearity requirements of CDMA, WCDMA, TD SCDMA and LTE with high power added efficiency (PAE). The self-contained 4.0 mm x 6.8 mm module package incorporates 50 ohm input and output matching networks. A CMOS controller uses standard MIPI®controls to provide the internal control interface and operation.
The SM53030 Power Amplifier Module (PAM) is a fully matched 20-pin surface-mount module developed for LTE applications. This PAM covers the full High- Band (2300–2690MHz), and meets the stringent spectral linearity requirements of LTE with high power added efficiency (PAE). The self-contained 3.0mmx3.0mm module package incorporates 50-ohminput and output matching networks. A CMOS controller uses standard MIPI® controls to provide the internal control interface and operation.
SANA’s Power Amplifier Modules by the exceptionally small form factor of 2.5 mm x 3 mm are grouped under the SD3xxx series. Designed for use in LTE, WCDMA, HSDPA, HSUPA and HSPA+ applications, they surpass competing products by using a single socket and form factor for single, dual, triple and quad bands.
SANA proudly presents its S2xx series, the world’s smallest Power Amplifier Modules (PAMs) by the form factor of 2 mm x 2 mm.
Measuring 3 mm by 3 mm by 0.9 mm, SANA’s Power Amplifier Module in the S3xxx series are highly competitive in the market with its high efficiency, power down control, integrated directional coupler and optimization for DC-DC supply.
The technologies behind SANA’s PAMs are not only advanced but, more importantly, effective in achieving target level of miniaturization.
SANA’s monolithic high performance PAMs are designed based on GaAs and other process technologies, and have no Surface Mounted Devices (SMD) in the modules. The interfaces of SANA’s multimode multiband power amplifiers (MMMB PAs) are developed in accordance with MIPI® Alliance Specification for RF Front-End (RFFE) Control Interface. In addition, SANA employs pioneering packaging technologies based on flip chip to enable form factor reduction for MMMB PAs. Furthermore, SANA has been working on Advanced Envelope Tracking Power Amplifier Architectures for LTE.
SANA has developed platforms for rapid development of custom multiband PAs.
Founded by a technology entrepreneur from Silicon Valley in 2009, SANA has been focusing on developing Power Amplifier Modules (PAMs) for mobile phones and other 3G/4G/5G wireless devices.
SANA has established its production with sizable production capacity catered to rapid surge in demand. Currently SANA is offering a wide range of PAMs to handset and mobile devices manufacturers in China and Korea.
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Pak Shek Kok, NT, Hong Kong
info@sanasemi.com